Improvement of electrical performance of anisotropically conductive adhesives

Author

Li, Yi ; Moon, Kyoung-Sik ; Wong, C.P.

Author_Institution

Sch. of Mater. Sci. & Eng., Georgia Inst. of Technol., Atlanta, GA, USA

fYear

2005

fDate

16-18 March 2005

Firstpage

221

Lastpage

226

Abstract

To improve the electrical properties of the anisotropically conductive adhesive (ACA) joints with the potential for fine pitch interconnect, self-assembled monolayer (SAM) compounds are introduced to treat nano silver (Ag) fillers. Thermogravimetric analyzer (TGA), differential scanning calorimeter (DSC), contact angle and photoacoustic Fourier transfer infrared (FTIR) results indicated the SAMs were well coated on the nano Ag particles. Furthermore, these SAM-treated ACAs were thermally stable at processing temperatures of the ACA samples. By introducing the novel SAM materials into the interfaces between nano metal fillers and the substrate bond pads, the conductivity and current carrying capability of ACAs were improved significantly due to the stronger bonding between nano fillers and SAM and consequently the improved interface properties of the high performance ACA. The improved electrical performance of nano Ag filled ACAs was accompanied with the higher thermal conductivity as well.

Keywords

adhesives; coatings; conducting polymers; electrical conductivity; filled polymers; filler metals; fine-pitch technology; integrated circuit interconnections; monolayers; self-assembly; silver; thermal conductivity; ACA joint; Ag; SAM coating; SAM materials; anisotropically conductive adhesive; bonding; contact angle; current carrying capability; differential scanning calorimeter; electrical performance improvement; fine pitch interconnect; interface properties; nano silver filler treatment; photoacoustic Fourier transfer infrared; self-assembled monolayer compound; thermal conductivity; thermogravimetric analyzer; Anisotropic magnetoresistance; Bonding; Conducting materials; Conductive adhesives; Contacts; Inorganic materials; Self-assembly; Silver; Temperature; Thermal conductivity;

fLanguage

English

Publisher

ieee

Conference_Titel

Advanced Packaging Materials: Processes, Properties and Interfaces, 2005. Proceedings. International Symposium on

ISSN

1550-5723

Print_ISBN

0-7803-9085-7

Electronic_ISBN

1550-5723

Type

conf

DOI

10.1109/ISAPM.2005.1432079

Filename

1432079