DocumentCode :
3220683
Title :
Improvement of electrical performance of anisotropically conductive adhesives
Author :
Li, Yi ; Moon, Kyoung-Sik ; Wong, C.P.
Author_Institution :
Sch. of Mater. Sci. & Eng., Georgia Inst. of Technol., Atlanta, GA, USA
fYear :
2005
fDate :
16-18 March 2005
Firstpage :
221
Lastpage :
226
Abstract :
To improve the electrical properties of the anisotropically conductive adhesive (ACA) joints with the potential for fine pitch interconnect, self-assembled monolayer (SAM) compounds are introduced to treat nano silver (Ag) fillers. Thermogravimetric analyzer (TGA), differential scanning calorimeter (DSC), contact angle and photoacoustic Fourier transfer infrared (FTIR) results indicated the SAMs were well coated on the nano Ag particles. Furthermore, these SAM-treated ACAs were thermally stable at processing temperatures of the ACA samples. By introducing the novel SAM materials into the interfaces between nano metal fillers and the substrate bond pads, the conductivity and current carrying capability of ACAs were improved significantly due to the stronger bonding between nano fillers and SAM and consequently the improved interface properties of the high performance ACA. The improved electrical performance of nano Ag filled ACAs was accompanied with the higher thermal conductivity as well.
Keywords :
adhesives; coatings; conducting polymers; electrical conductivity; filled polymers; filler metals; fine-pitch technology; integrated circuit interconnections; monolayers; self-assembly; silver; thermal conductivity; ACA joint; Ag; SAM coating; SAM materials; anisotropically conductive adhesive; bonding; contact angle; current carrying capability; differential scanning calorimeter; electrical performance improvement; fine pitch interconnect; interface properties; nano silver filler treatment; photoacoustic Fourier transfer infrared; self-assembled monolayer compound; thermal conductivity; thermogravimetric analyzer; Anisotropic magnetoresistance; Bonding; Conducting materials; Conductive adhesives; Contacts; Inorganic materials; Self-assembly; Silver; Temperature; Thermal conductivity;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Advanced Packaging Materials: Processes, Properties and Interfaces, 2005. Proceedings. International Symposium on
ISSN :
1550-5723
Print_ISBN :
0-7803-9085-7
Electronic_ISBN :
1550-5723
Type :
conf
DOI :
10.1109/ISAPM.2005.1432079
Filename :
1432079
Link To Document :
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