DocumentCode
3220751
Title
Dielectric polymers embedded with high-k coated conducting particles: effective dielectric properties modeling
Author
Vo, Huy T. ; Shi, F.G.
Author_Institution
Optoelectronics Packaging & Autom. Lab, California Univ., Irvine, CA, USA
fYear
2005
fDate
16-18 March 2005
Firstpage
233
Lastpage
236
Abstract
High dielectric constant (high-k) materials are needed for embedded passives in advanced packaging applications. This work presents a systematic theoretical investigation of the effective dielectric constant, dielectric loss of dielectric polymers filled with high-k coated conducting particles with the objective to aid the design of polymer/filler composite materials with high dielectric constant and low dielectric loss at high frequencies. Our results demonstrate that, contrary to prevailing views, the filler concentration and coating layer thickness dependences of the effective dielectric constant and loss are nonmonotonic. Implications for high-k materials design are also outlined.
Keywords
capacitors; composite materials; conducting polymers; dielectric losses; dielectric materials; dielectric resonators; electronics packaging; failure analysis; integrated circuits; permittivity; advanced packaging applications; conducting polymers; dielectric loss; dielectric materials; dielectric polymers; dielectric properties modeling; electronics packaging; filler composite materials; high dielectric constant materials; high-k coated conducting particles; high-k materials; permittivity; Coatings; Composite materials; Conducting materials; Dielectric constant; Dielectric losses; Frequency; High K dielectric materials; High-K gate dielectrics; Packaging; Polymer films;
fLanguage
English
Publisher
ieee
Conference_Titel
Advanced Packaging Materials: Processes, Properties and Interfaces, 2005. Proceedings. International Symposium on
ISSN
1550-5723
Print_ISBN
0-7803-9085-7
Electronic_ISBN
1550-5723
Type
conf
DOI
10.1109/ISAPM.2005.1432081
Filename
1432081
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