Title :
Dielectric polymers embedded with high-k coated conducting particles: effective dielectric properties modeling
Author :
Vo, Huy T. ; Shi, F.G.
Author_Institution :
Optoelectronics Packaging & Autom. Lab, California Univ., Irvine, CA, USA
Abstract :
High dielectric constant (high-k) materials are needed for embedded passives in advanced packaging applications. This work presents a systematic theoretical investigation of the effective dielectric constant, dielectric loss of dielectric polymers filled with high-k coated conducting particles with the objective to aid the design of polymer/filler composite materials with high dielectric constant and low dielectric loss at high frequencies. Our results demonstrate that, contrary to prevailing views, the filler concentration and coating layer thickness dependences of the effective dielectric constant and loss are nonmonotonic. Implications for high-k materials design are also outlined.
Keywords :
capacitors; composite materials; conducting polymers; dielectric losses; dielectric materials; dielectric resonators; electronics packaging; failure analysis; integrated circuits; permittivity; advanced packaging applications; conducting polymers; dielectric loss; dielectric materials; dielectric polymers; dielectric properties modeling; electronics packaging; filler composite materials; high dielectric constant materials; high-k coated conducting particles; high-k materials; permittivity; Coatings; Composite materials; Conducting materials; Dielectric constant; Dielectric losses; Frequency; High K dielectric materials; High-K gate dielectrics; Packaging; Polymer films;
Conference_Titel :
Advanced Packaging Materials: Processes, Properties and Interfaces, 2005. Proceedings. International Symposium on
Print_ISBN :
0-7803-9085-7
Electronic_ISBN :
1550-5723
DOI :
10.1109/ISAPM.2005.1432081