The role of self-assembled monolayer (SAM) on Ag nanoparticles for conductive nanocomposite

Author

Jiang, Hongjin ; Moon, Kyoung-Sik ; Zhu, Lingbo ; Lu, Jiongxin ; Wong, C.P.

Author_Institution

Sch. of Mater. Sci. & Eng., Georgia Inst. of Technol., Atlanta, GA, USA

fYear

2005

fDate

16-18 March 2005

Firstpage

266

Lastpage

271

Abstract

To improve the electrical property of the isotropic conductive adhesives (ICA), self-assembled monolayer (SAM) compounds were used to help the dispersion of silver nanoparticles in epoxy resin. Silver nanoparticles were first treated by the SAM in order to increase the filler loading of nanoparticles in epoxy resin. The bonding and thermal debonding behavior between silver and SAM was investigated by differential scanning calorimeter (DSC). The amount of SAM coated on Ag nanoparticles was tested by thermogravimetric analysis (TGA). Scanning electron microscopy (SEM) was used to study the morphologies of SAM treated Ag nanoparticles before and after the heat treatment. Several kinds of epoxy formulation were prepared by using SAM-treated Ag nanoparticles as conductive fillers and the resistivities were studied.

Keywords

adhesive bonding; adhesives; conducting materials; conducting polymers; differential scanning calorimetry; dispersion hardening; electrical resistivity; filled polymers; heat treatment; monolayers; nanocomposites; nanoparticles; self-assembly; silver; surface morphology; surface treatment; adhesive bonding; bonding behavior; conducting materials; conductive nanocomposite; differential scanning calorimeter; differential scanning calorimetry; electrical resistivity; epoxy formulation; epoxy resin; heat treatment; isotropic conductive adhesives; polymers; self-assembled monolayer compounds; silver nanoparticles; surface morphology; thermal debonding behavior; thermogravimetric analysis; Bonding; Conductive adhesives; Epoxy resins; Independent component analysis; Morphology; Nanoparticles; Scanning electron microscopy; Self-assembly; Silver; Testing;

fLanguage

English

Publisher

ieee

Conference_Titel

Advanced Packaging Materials: Processes, Properties and Interfaces, 2005. Proceedings. International Symposium on

ISSN

1550-5723

Print_ISBN

0-7803-9085-7

Electronic_ISBN

1550-5723

Type

conf

DOI

10.1109/ISAPM.2005.1432087

Filename

1432087