DocumentCode

322097

Title

Applying A Low-cost Linear Inspection System For High Precision Measurement Of IC Leadframes

Author

Ho, S.L.E.

Author_Institution

French-Singapore Institute

Volume

1

fYear

1988

fDate

24-28 Oct. 1988

Firstpage

258

Lastpage

263

Keywords

Assembly; Bonding; Fingers; Image processing; Inspection; Machine vision; Manufacturing automation; Microscopy; Production; Prototypes;

fLanguage

English

Publisher

ieee

Conference_Titel

Industrial Electronics Society, 1988. IECON '88. Proceedings., 14 Annual Conference of

Conference_Location

Singapore

Type

conf

DOI

10.1109/IECON.1988.662379

Filename

662379