• DocumentCode
    3221047
  • Title

    Breakdown strength of cross-linked polyethylene affected by semiconducting electrode interface condition

  • Author

    Okamoto, Tatsuki ; Hozumi, Naohiro ; Ishida, Masayoshi ; Imajo, Takahisa

  • Author_Institution
    Central Res. Inst. of Electr. Power Ind., Yokosuka, Japan
  • fYear
    1992
  • fDate
    22-25 Jun 1992
  • Firstpage
    403
  • Lastpage
    406
  • Abstract
    Cable specimens with 3.5 mm insulation thickness made of different kinds of modified semiconducting materials were investigated in terms of the impulse breakdown strength and the lamella angle. Several specimens showed improvements in 50% and 1% Weibull breakdown strength. 50% Weibull breakdown strength was improved about 10% and 1% Weibul breakdown strength was improved by about 40%. The lamella angle, which is one of the parameters that characterizes the hyperstructure of XLPE (cross-linked polyethylene) insulation at the semiconducting interface in a cable specimen, was considered. A strong correlation between the breakdown strength of XLPE power cables and the lamella angle was found
  • Keywords
    cable insulation; electric breakdown of solids; electric strength; electrodes; organic insulating materials; polymers; power cables; semiconductor-insulator boundaries; 3.5 mm; Weibull breakdown strength; XLPE; cross-linked polyethylene; hyperstructure; impulse breakdown strength; insulation; lamella angle; modified semiconducting materials; power cables; semiconducting electrode interface; Additives; Cable insulation; Electric breakdown; Electrodes; Plastic insulation; Polyethylene; Polymers; Power cables; Semiconductivity; Semiconductor device breakdown;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Conduction and Breakdown in Solid Dielectrics, 1992., Proceedings of the 4th International Conference on
  • Conference_Location
    Sestri Levante
  • Print_ISBN
    0-7803-0129-3
  • Type

    conf

  • DOI
    10.1109/ICSD.1992.225001
  • Filename
    225001