DocumentCode
3221578
Title
Fabrication of nano holes array on Si substrate using anodically oxidized aluminum etching mask
Author
Shingubara, S. ; Okino, O. ; Nakaso, K. ; Sakaue, H. ; Takahagi, T.
Author_Institution
Dept. of Electr. Eng., Hiroshima Univ., Japan
fYear
1999
fDate
6-8 July 1999
Firstpage
124
Lastpage
125
Abstract
The present study aims at the pattern transfer of nano hole array of alumina to Si semiconductor single crystalline substrates for wide applications to micro-electronics. The authors have succeeded in nano holes array fabrication on Si with diameter much smaller than that of the porous alumina nano holes etching mask. The etching process combined with sputtering and redeposition effect was very effective to reduce the transferred hole array from 60 to 13 nm. The present method is very promising for fabrication of room temperature operated quantum dot devices.
Keywords
alumina; arrays; elemental semiconductors; etching; masks; nanotechnology; silicon; substrates; Al; Al/sub 2/O/sub 3/; Si; Si substrate; alumina; anodically oxidized aluminum etching mask; fabrication; nano holes array; pattern transfer; redeposition effect; room temperature operated quantum dot devices; single crystalline substrates; sputtering; Aluminum; Chemicals; Electron beams; Fabrication; Oxidation; Semiconductor films; Sputter etching; Sputtering; Substrates; Wet etching;
fLanguage
English
Publisher
ieee
Conference_Titel
Microprocesses and Nanotechnology Conference, 1999. Digest of Papers. Microprocesses and Nanotechnology '99. 1999 International
Conference_Location
Yokohama, Japan
Print_ISBN
4-930813-97-2
Type
conf
DOI
10.1109/IMNC.1999.797508
Filename
797508
Link To Document