DocumentCode
3221806
Title
Radiation damage in focused ion beam implantation
Author
Hausmann, S. ; Bischoff, L. ; Teichert, J. ; Voelskow, M. ; Moller, W.
Author_Institution
Inst. fur Ionenstrahlphys. und Materialforschung, Forschungszentrum Rossendorf eV, Germany
fYear
1999
fDate
6-8 July 1999
Firstpage
146
Lastpage
147
Abstract
Compared to conventional ion implantation, focused ion beam (FIB) implantation works with a current density which is up to five orders of magnitude higher. This has an effect on the accumulated radiation damage during the implantation process. The present work shows how the radiation damage is influenced by the dwell-time in the case of focused ion beam synthesis (IBS) of cobalt disilicide. If the accumulated damage during implantation is not too high the use of conventional ion implantation IBS results in single-crystalline CoSi/sub 2/ layers.
Keywords
cobalt; elemental semiconductors; focused ion beam technology; ion implantation; silicon; CoSi/sub 2/; Si:Co; current density; dwell-time; focused ion beam implantation; radiation damage; Annealing; Cobalt; Crystallization; Current density; Ion beams; Ion implantation; Ion sources; Nitrogen; Silicon; Temperature;
fLanguage
English
Publisher
ieee
Conference_Titel
Microprocesses and Nanotechnology Conference, 1999. Digest of Papers. Microprocesses and Nanotechnology '99. 1999 International
Conference_Location
Yokohama, Japan
Print_ISBN
4-930813-97-2
Type
conf
DOI
10.1109/IMNC.1999.797519
Filename
797519
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