• DocumentCode
    3221806
  • Title

    Radiation damage in focused ion beam implantation

  • Author

    Hausmann, S. ; Bischoff, L. ; Teichert, J. ; Voelskow, M. ; Moller, W.

  • Author_Institution
    Inst. fur Ionenstrahlphys. und Materialforschung, Forschungszentrum Rossendorf eV, Germany
  • fYear
    1999
  • fDate
    6-8 July 1999
  • Firstpage
    146
  • Lastpage
    147
  • Abstract
    Compared to conventional ion implantation, focused ion beam (FIB) implantation works with a current density which is up to five orders of magnitude higher. This has an effect on the accumulated radiation damage during the implantation process. The present work shows how the radiation damage is influenced by the dwell-time in the case of focused ion beam synthesis (IBS) of cobalt disilicide. If the accumulated damage during implantation is not too high the use of conventional ion implantation IBS results in single-crystalline CoSi/sub 2/ layers.
  • Keywords
    cobalt; elemental semiconductors; focused ion beam technology; ion implantation; silicon; CoSi/sub 2/; Si:Co; current density; dwell-time; focused ion beam implantation; radiation damage; Annealing; Cobalt; Crystallization; Current density; Ion beams; Ion implantation; Ion sources; Nitrogen; Silicon; Temperature;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Microprocesses and Nanotechnology Conference, 1999. Digest of Papers. Microprocesses and Nanotechnology '99. 1999 International
  • Conference_Location
    Yokohama, Japan
  • Print_ISBN
    4-930813-97-2
  • Type

    conf

  • DOI
    10.1109/IMNC.1999.797519
  • Filename
    797519