DocumentCode :
3221806
Title :
Radiation damage in focused ion beam implantation
Author :
Hausmann, S. ; Bischoff, L. ; Teichert, J. ; Voelskow, M. ; Moller, W.
Author_Institution :
Inst. fur Ionenstrahlphys. und Materialforschung, Forschungszentrum Rossendorf eV, Germany
fYear :
1999
fDate :
6-8 July 1999
Firstpage :
146
Lastpage :
147
Abstract :
Compared to conventional ion implantation, focused ion beam (FIB) implantation works with a current density which is up to five orders of magnitude higher. This has an effect on the accumulated radiation damage during the implantation process. The present work shows how the radiation damage is influenced by the dwell-time in the case of focused ion beam synthesis (IBS) of cobalt disilicide. If the accumulated damage during implantation is not too high the use of conventional ion implantation IBS results in single-crystalline CoSi/sub 2/ layers.
Keywords :
cobalt; elemental semiconductors; focused ion beam technology; ion implantation; silicon; CoSi/sub 2/; Si:Co; current density; dwell-time; focused ion beam implantation; radiation damage; Annealing; Cobalt; Crystallization; Current density; Ion beams; Ion implantation; Ion sources; Nitrogen; Silicon; Temperature;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Microprocesses and Nanotechnology Conference, 1999. Digest of Papers. Microprocesses and Nanotechnology '99. 1999 International
Conference_Location :
Yokohama, Japan
Print_ISBN :
4-930813-97-2
Type :
conf
DOI :
10.1109/IMNC.1999.797519
Filename :
797519
Link To Document :
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