Experiments to minimize frequency shifts and yield losses for surface mount filters

Deals with experiments that were used to determine an acceptable thermal conditioning sequence. To be acceptable, thermal conditioning must be sufficiently high to provide cross-linking of the material to itself and to the bond sites. Also it must be sufficiently low so as not to shock or degrade the adhesive material. Because the size and location of the adhesive dots are related to the amount of thermal stresses, this paper will also describe experiments that were related to robotic adhesive settings and robotic quartz element placement. These were important because they are directly related to frequency stability in the customer application. The experiments were performed for a solder seal package and a seam weld package. The package design for each seal process is unique; therefore, each process requires its own set of pre-conditions and its own amounts and locations of adhesives