Improvement of the Adhesive Bond Strength between Metals and Polymers by Plasmachemical and Wet-chemical Pretreatments

Author

Friedrich, Jorg ; Mix, Renate

Author_Institution

Fed. Inst. of Mater. Res. & Testing, Berlin

Volume

2

fYear

2006

fDate

5-7 Sept. 2006

Firstpage

818

Lastpage

826

Abstract

Several adhesion problems between metal layers and polymers exist in various electronic assemblies due to the deficiency or absence of strong covalent bonds associated with the strongly different thermal expansion coefficients of the materials. Here, ways are described to establish well-defined covalent bonds at the interfaces. Additionally, unwished redox-reactions between metals, metal oxides and polymers can disturb covalent bonds and therefore the adhesive bond strength

Keywords

adhesive bonding; assembling; bonds (chemical); metals; oxidation; polymers; reduction (chemical); thermal expansion; adhesive bond strength; covalent bonds; electronic assemblies; metal layers; plasmachemical pretreatments; polymers; redox-reactions; thermal expansion coefficients; wet-chemical pretreatments; Adhesives; Bonding; Electronic packaging thermal management; Inorganic materials; Plasma applications; Plasma chemistry; Plasma materials processing; Polymers; Semiconductor materials; Thermal expansion;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronics Systemintegration Technology Conference, 2006. 1st

Conference_Location

Dresden

Print_ISBN

1-4244-0552-1

Electronic_ISBN

1-4244-0553-x

Type

conf

DOI

10.1109/ESTC.2006.280106

Filename

4060831