Implications of Assembly Sequences on Yield and Costs 3D-CSP Modules

In this paper we present an analytical model for the calculation of cost and yield of incrementally assembled 3D-stacked multi-chip modules. We adopt generic cost and yield estimation models, investigate alternative building techniques and assess the sensitivity of the various model parameters, including yield per building step, availability of known good dies and testing per building step. We apply the model for the estimation of cost of a complex 3D system in package based on the RMPD 3D-CSPreg technology