DocumentCode :
3222195
Title :
Machine and Process Capability Analysis in SMT Manufacturing
Author :
Schmitt, Romain
Author_Institution :
CeTaQ GmbH, Radeberg
Volume :
2
fYear :
2006
fDate :
5-7 Sept. 2006
Firstpage :
867
Lastpage :
872
Abstract :
The strive towards increasing capacity, throughput on lead-free processes and accuracy with more and ever smaller components has changed the way of producing SMT boards. The need for statistical process control for each part of the process has become paramount in today´s electronics manufacturing to keep up with market demand, ensure customer satisfaction and reduce defect rates
Keywords :
consumer electronics; printed circuit manufacture; surface mount technology; SMT manufacturing; customer satisfaction; defect rates reduction; lead free processes; process capability analysis; statistical process control; Consumer electronics; Control systems; Electrical equipment industry; Electronic equipment manufacture; Industrial control; Manufacturing industries; Manufacturing processes; Process control; Production; Surface-mount technology;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronics Systemintegration Technology Conference, 2006. 1st
Conference_Location :
Dresden
Print_ISBN :
1-4244-0552-1
Electronic_ISBN :
1-4244-0553-x
Type :
conf
DOI :
10.1109/ESTC.2006.280113
Filename :
4060838
Link To Document :
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