Title :
Tactile integrated circuit sensor realized with a piezoelectric polymer
Author :
Kolesar, E.S. ; Dyson, C.S. ; Reston, R.R. ; Fitch, R.C. ; Ford, D.G. ; Nelms, S.D.
Author_Institution :
Dept. of Eng., Texas Christian Univ., Fort Worth, TX, USA
Abstract :
A two-dimensional, electrically-multiplexed tactile sensor was realized by coupling a piezoelectric polyvinylidene fluoride (PVDF) polymer film to a monolithic silicon integrated circuit (IC). The IC incorporates 64 sensor electrodes arranged in a symmetrical 8×8 matrix. Each electrode occupies a 400×400 μm square area, and they are separated from each other by 300 μm. A 40-μm thick piezoelectric PVDF polymer film was attached to the electrode array with a non-conductive urethane adhesive. The response of the tactile sensor is linear for loads spanning 0.8 to 135 grams-of-force (gmf) (0.008-1.35 Newtons (N)). The time required to electrically interrogate, measure, and record the response of the sensor´s set of 64 taxels is less than 50 ms, the hysteresis level is tolerable, and, for operation in the sensor´s linear range, taxel crosstalk is negligible. The historically persistent stability and response reproducibility limitations associated with piezoelectric-based tactile sensors have been resolved by implementing a pre-charge voltage bias technique to establish known pre- and post-load sensor responses. A rudimentary tactile object image measurement procedure has been devised to recognize the silhouette of a sharp edge, square, trapezoid, isosceles triangle, circle, toroid, slotted screw, and cross-slotted screw
Keywords :
object recognition; piezoelectric transducers; polymer films; tactile sensors; PVDF film; electrical multiplexing; image measurement; monolithic silicon integrated circuit; object recognition; piezoelectric polymer; pre-charge voltage bias; two-dimensional tactile sensor; Coupling circuits; Electric variables measurement; Electrodes; Fasteners; Monolithic integrated circuits; Polymer films; Silicon; Symmetric matrices; Tactile sensors; Time measurement;
Conference_Titel :
Innovative Systems in Silicon, 1996. Proceedings., Eighth Annual IEEE International Conference on
Conference_Location :
Austin, TX
Print_ISBN :
0-7803-3639-9
DOI :
10.1109/ICISS.1996.552444