Title :
LED array modules by new method micron bump bonding method
Author :
Hatada, Kenzo ; Fujimoto, Hiroaki ; Ochi, Takao ; Ishida, Youichiro
Author_Institution :
Matsushita Electr. Ind. Co. Ltd., Osaka, Japan
Abstract :
An LED (light-emitting diode) array module was developed by employing the micron bump bonding technique, in which electrodes of LSI chips and circuit substrate are press-bonded by utilizing the shrinkage stress produced in a light-setting insulating resin. The developed LED array module has a resolution of 400 DPI, and is constructed by face-down mounting of 54 LED chips and 54 driver LSIs on a glass substrate. These LED chips, which have an electrode pitch of 63.5 μm, are disposed on the glass substrate at a pitch of 10 μm. A dedicated bonder was developed for this assembling work
Keywords :
large scale integration; lead bonding; light emitting diodes; 10 micron; LED array modules; LSI chips; circuit substrate; dedicated bonder; driver LSIs; electrode pitch; face-down mounting; light-setting insulating resin; micron bump bonding method; press-bonded; shrinkage stress; Bonding; Circuits; Electrodes; Glass; Insulation; Large scale integration; Light emitting diodes; Optical arrays; Resins; Stress;
Conference_Titel :
Electronic Manufacturing Technology Symposium, 1989, Proceedings. Seventh IEEE/CHMT International
Conference_Location :
San Francisco, CA
DOI :
10.1109/EMTS.1989.68980
