The EC Technology Challenges of Copper Deposition in Through Mask Application

The integration of electrochemically deposited copper into the wafer level packaging area has become an important and widely discussed topic. Besides the electrical and thermal advantages of copper interconnections, the dimensional stability is as well a beneficial feature for all new packaging designs and technologies. All corresponding industry applications, as there are copper pillar, redistribution layer, copper interconnections or deep silicon via filling are related to the balance of base chemical and additive ratio, as well as the process impact of the hydro dynamic flow conditions in different plating tool configurations