DocumentCode
3223467
Title
Temperature Field Simulation of Thick-Film Microcircuits Using Electro-Thermal Analogy
Author
Blad, Grzegorz ; Kalita, Wlodzimierz ; Klepacki, Dariusz ; Potencki, Jerzy ; Weglarski, M.
Author_Institution
Dept. of Electron. & Commun. Syst., Rzeszow Univ. of Technol.
Volume
2
fYear
2006
fDate
5-7 Sept. 2006
Firstpage
1261
Lastpage
1265
Abstract
The paper presents some aspects of describing of thermal model of the thick-film microcircuits with equivalent model (based on RC elements) which is used in temperature field simulation using PSPICE program. The proposed method of temperature simulation using equivalent RC models is based on well-known Beuken theory and is much more easier and "intuitive" for designers of the electronic equipment
Keywords
equivalent circuits; heat transfer; thick film circuits; Beuken theory; PSPICE program; electro-thermal analogy; equivalent RC models; temperature field simulation; thick-film microcircuits; Capacitance; Circuit simulation; Electric resistance; Equations; Equivalent circuits; Nonhomogeneous media; SPICE; Temperature; Thermal conductivity; Thermal resistance;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronics Systemintegration Technology Conference, 2006. 1st
Conference_Location
Dresden
Print_ISBN
1-4244-0552-1
Electronic_ISBN
1-4244-0553-x
Type
conf
DOI
10.1109/ESTC.2006.280173
Filename
4060898
Link To Document