• DocumentCode
    3223562
  • Title

    ISPM characterization of gas phase nucleation in a Novellus C1 WCVD process chamber

  • Author

    Winter, Tom ; Colston, Dan ; Mickler, Ed ; Woodward, Randy ; Kimmich, Mark ; Green, Todd

  • Author_Institution
    Texas Instrum. Inc., Dallas, TX, USA
  • fYear
    1995
  • fDate
    13-15 Nov 1995
  • Firstpage
    17
  • Lastpage
    22
  • Abstract
    An High Yield Technology model 70 in-situ particle monitor (ISPM) has been installed on the pumpline of a Novellus C1 WCVD process chamber in an effort to better characterize and control the particle performance of the chamber, especially as it pertains to gas phase nucleation (GPN) in the tool. GPN results when the SiH4:WF6 ratio exceeds 1:1 at the system operating pressure and temperature. During experimentation the GPN boundary conditions were identified and the factors which controlled the phenomena were explored. The ISPM was used to detect the occurrence of a GPN event. A good correlation between high ISPM counts and in-film particles was established. The ISPM was a crucial element in identifying process boundary conditions as they related to GPN; this in turn helped assure control of the process wafers. An additional effect was noted as relates to formation and deposition of the nucleation sites on the wafer. In a two wafer test GPN was purposely generated, with the ISPM detecting comparable levels of particles during the processing of both wafers; however, very few particles were detected on the first wafer whereas several hundred particles were detected on the second wafer. This effect has been attributed to thermophoretic effects protecting the first wafer, with the second wafer being contaminated before it was heated.
  • Keywords
    chemical vapour deposition; inspection; metallisation; nucleation; tungsten; ISPM; Novellus C1 WCVD process chamber; W; boundary conditions; gas phase nucleation; high yield technology; in-film particles; in-situ particle monitoring; thermophoresis; wafer contamination; Boundary conditions; Chemical engineering; Chemical technology; Contact resistance; Hydrogen; Instruments; Materials science and technology; Monitoring; Plugs; Process control;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Advanced Semiconductor Manufacturing Conference and Workshop, 1995. ASMC 95 Proceedings. IEEE/SEMI 1995
  • ISSN
    1078-8743
  • Print_ISBN
    0-7803-2713-6
  • Type

    conf

  • DOI
    10.1109/ASMC.1995.484331
  • Filename
    484331