Test Chip for Characterization of Mechanical Stress Caused by Packaging Processes

Author

Hirsch, Soeren ; Schmidt, Marc-Peter ; Schmidt, Bertram

Author_Institution

Inst. of Micro & Sensor Syst., Otto-von-Guericke-Univ. Magdeburg

Volume

2

fYear

2006

fDate

5-7 Sept. 2006

Firstpage

1312

Lastpage

1317

Abstract

This paper reports on a method for estimation and minimization of mechanical stress on MEMS sensor and actuator structures due to packaging processes based on flip chip technology. For studying mechanical stress a test chip with silicon diaphragms was fabricated. A network of piezo-resistive solid state resistors created by diffusion was used to measure the surface tension pattern between adjacent diaphragms. Finite element method simulation was used to calculate the stress profile and to determine the optimum positions for placing the resistive network

Keywords

diaphragms; electronics packaging; finite element analysis; flip-chip devices; microactuators; microsensors; piezoresistive devices; silicon; surface tension; MEMS actuator; MEMS sensor; diffusion process; finite element simulation; flip chip technology; mechanical stress characterization; packaging processes; piezoresistive resistor; silicon diaphragms; solid state resistors; stress profile; surface tension pattern; Actuators; Flip chip; Mechanical sensors; Micromechanical devices; Minimization methods; Packaging; Sensor phenomena and characterization; Silicon; Stress; Testing;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronics Systemintegration Technology Conference, 2006. 1st

Conference_Location

Dresden

Print_ISBN

1-4244-0552-1

Electronic_ISBN

1-4244-0553-x

Type

conf

DOI

10.1109/ESTC.2006.280180

Filename

4060905