• DocumentCode
    3223709
  • Title

    Ultrasonic characterization of polymer infiltration into foam materials

  • Author

    Blackshire, James L. ; Ko, Ray T. ; Chen, Ming-Yung

  • Author_Institution
    Air Force Res. Lab. (AFRL/RXLP), Wright-Patterson AFB, OH, USA
  • fYear
    2011
  • fDate
    18-21 Oct. 2011
  • Firstpage
    2146
  • Lastpage
    2149
  • Abstract
    The development of advanced multi-material systems has become increasingly complex with regard to performance requirements, tailorable material options, and recent innovations in manufacturing technologies. The increased development and use of engineering foam material systems, for example, has recently led to significant improvements in the weight, cost, and performance of materials used in insulating, thermal protection, sound deadening, and lightweight structural materials. An important aspect of such complex multi-material systems includes the ability to effectively join two or more materials and characterize the processing results. In the present effort, the use of ultrasound for characterizing the infiltration of a polymer material into a foam is investigated using computational models and experimental validation studies. Characteristic pulse-echo signal responses utilizing time-of-flight reflection and attenuation were used to provide an effective means for estimating the fill-factor of the polymer into a foam material, where optimization of the thermal and structural performance of the material system is desired.
  • Keywords
    aluminium; foams; polymers; ultrasonic applications; Al; computational models; foam materials; multimaterial systems; polymer infiltration; pulse-echo signal responses; structural performance; thermal performance; time-of-flight attenuation; time-of-flight reflection; ultrasonic characterization; Acoustics; Aluminum; Computational modeling; Polymers; Reflection; Scattering; FEM; Foam Infiltration; Ultrasound;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Ultrasonics Symposium (IUS), 2011 IEEE International
  • Conference_Location
    Orlando, FL
  • ISSN
    1948-5719
  • Print_ISBN
    978-1-4577-1253-1
  • Type

    conf

  • DOI
    10.1109/ULTSYM.2011.0532
  • Filename
    6293079