• DocumentCode
    3223730
  • Title

    Three-dimensional crack depth profile assessment using near-field surface acoustic wave signal response

  • Author

    Blackshire, James L.

  • Author_Institution
    Air Force Res. Lab. (AFRL/RXLP), Wright-Patterson AFB, OH, USA
  • fYear
    2011
  • fDate
    18-21 Oct. 2011
  • Firstpage
    1794
  • Lastpage
    1797
  • Abstract
    A method for determining the three-dimensional depth profile of a surface-breaking crack-like feature is presented based on near-field surface acoustic wave signal responses. Three-dimensional finite element models were used to study the forward problem, where the characteristic near-field scattering of a surface acoustic wave incident on a simulated crack was investigated. Experimental validation of the modeling predictions was accomplished using a wedge transducer for surface wave generation and a scanning laser vibrometry system for surface wave detection. The characteristic near-field amplitude response in reflection and in transmission was measured and modeled for flat-bottom, angled, and curved-bottom localized notch features, where a simple linear inversion method was developed, which provided an effective means for characterizing and mapping the three-dimensional depth profile of surface-breaking crack-like features with depths in the micron to millimeter range.
  • Keywords
    finite element analysis; surface acoustic wave signal processing; surface acoustic wave transducers; characteristic near-field amplitude response; characteristic near-field scattering; localized notch features; modeling predictions; near-field surface acoustic wave signal response; scanning laser vibrometry system; simple linear inversion method; simulated crack; surface acoustic wave incident; surface wave detection; surface wave generation; surface-breaking crack-like feature; three-dimensional crack depth profile assessment; three-dimensional finite element models; wedge transducer; Scattering; Surface acoustic waves; Surface cracks; Surface morphology; Crack Depth Profile; Near Field Scattering; Surface Acoustic Wave;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Ultrasonics Symposium (IUS), 2011 IEEE International
  • Conference_Location
    Orlando, FL
  • ISSN
    1948-5719
  • Print_ISBN
    978-1-4577-1253-1
  • Type

    conf

  • DOI
    10.1109/ULTSYM.2011.0448
  • Filename
    6293081