DocumentCode
3223763
Title
Ultra-Flat "Mounted" Electronics
Author
Haberger, Karl ; Feil, Michael
Author_Institution
Fraunhofer Inst. for Reliability & Micro-Integration, Munich
Volume
2
fYear
2006
fDate
5-7 Sept. 2006
Firstpage
1356
Lastpage
1359
Abstract
The paper proposes a method to place encapsulated devices with a size of typically 100 mum micro capsules of this size can be fabricated in batch processes, and they can be dispensed or printed by coarse screen printing techniques. The electric properties of a desired element are roughly defined by the printing pattern, not by the single micro capsule. This means a lot of capsules form a single device. In order to provide an oriented deposition, as necessary in case of polarization dependent deposition, a magnetic alignment is proposed
Keywords
encapsulation; printed circuits; batch processes; coarse screen printing; electric properties; encapsulated devices; magnetic alignment; oriented deposition; polarization dependent deposition; printing pattern; single microcapsule; ultra-flat mounted electronics; Capacitors; Conductors; Costs; Dielectric substrates; Dielectric thin films; Electronic equipment testing; Polymers; Printing; Resistors; Stability;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronics Systemintegration Technology Conference, 2006. 1st
Conference_Location
Dresden
Print_ISBN
1-4244-0552-1
Electronic_ISBN
1-4244-0553-x
Type
conf
DOI
10.1109/ESTC.2006.280187
Filename
4060912
Link To Document