DocumentCode :
3224160
Title :
ULTRA-SOI: New generation of SOI CMOS model with physics based dynamic depletion characteristics
Author :
He, Frank ; Zhang, Jian ; Zhang, Lining ; Zhou, Xingye ; Zhou, Zhize ; Lin, Xinnan
Author_Institution :
Key Lab. of Integrated Microsyst., Peking Univ., Shenzhen, China
fYear :
2009
fDate :
25-27 Dec. 2009
Firstpage :
44
Lastpage :
49
Abstract :
ULTRA-SOI is a new generation of the channel-potential-based non-charge-sheet model for the dynamic depletion (DD) Silicon-On-Insulator (SOI) MOSFET, developed by TSRC group in EECS department of Peking University with many year efforts. The model is formulated with a fully physical derivation from the Poisson´s equation to solve the potential along the vertical direction of the silicon film. The model is intended to retain as much detail physics as possible while providing sufficient flexibility to add advanced physical effects that arise from the development of new features in processing technology. Most small dimension effects have been incorporated in the model and being verified by extensive numerical simulation and experimental data. At present, the formulation of the I-V, C-V, and non-quasi-static (NQS) model has been completed.
Keywords :
CMOS integrated circuits; MOSFET; Poisson equation; elemental semiconductors; semiconductor device models; silicon; silicon-on-insulator; EECS department; MOSFET; Peking University; Poisson´s equation; SOI CMOS model; Si; TSRC group; ULTRA-SOI; channel-potential-based non-charge-sheet model; dynamic depletion silicon-on-insulator; physics based dynamic depletion characteristics; Character generation; Integral equations; MOSFET circuits; Numerical simulation; Physics; Poisson equations; Semiconductor device modeling; Semiconductor films; Semiconductor process modeling; Silicon; SOI-MOSFET; charge-sheet approximation; compact model; device physics; non-charge-sheet;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electron Devices and Solid-State Circuits, 2009. EDSSC 2009. IEEE International Conference of
Conference_Location :
Xi´an
Print_ISBN :
978-1-4244-4297-3
Electronic_ISBN :
978-1-4244-4298-0
Type :
conf
DOI :
10.1109/EDSSC.2009.5394192
Filename :
5394192
Link To Document :
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