• DocumentCode
    3224269
  • Title

    A High speed low power capacitorless SOI-DRAM cell using impact ionization and GIDL effect

  • Author

    Hou, Jianing ; Shao, Zhibiao ; Miao, Xin

  • Author_Institution
    Dept. of Microelectron., Xi´´an Jiaotong Univ., Xi´´an, China
  • fYear
    2009
  • fDate
    25-27 Dec. 2009
  • Firstpage
    517
  • Lastpage
    520
  • Abstract
    A high speed low power capacitorless SOI-DRAM cell using impact ionization and GIDL effect for write ¿1¿ operation was proposed. The conventional capacitorless DRAM cell with single mechanism is either high speed or low power,while the proposed DG-FinFET cell employs the efficient integration of impact ionization and GIDL effects by adopting negative bias on back gate to couple the front and back gates, yielding high speed low power performance. The simulation results demonstrate ideal characteristics in both cell operations and power consumption. The write operation of the cell is within 1ns attributed to the impact ionization effect. Low power consumption is achieved by using GIDL because the coupling between the front and back gates restrains the impact ionization current. The ratio of read ¿1¿ and read ¿0¿ current is more than 9.38E5. Moreover, the cell is non-destructive in read operation and has large sense margin and great retention characteristics.
  • Keywords
    DRAM chips; MOSFET circuits; high-speed integrated circuits; logic design; low-power electronics; silicon-on-insulator; DG-FinFET cell; GIDL effect; back gate; front gate; high speed low power capacitorless SOI-DRAM cell; impact ionization; negative bias; power consumption; time 1 ns; Capacitors; Energy consumption; FinFETs; Impact ionization; MOSFETs; Power generation; Random access memory; Semiconductor devices; Silicon on insulator technology; Technology forecasting; Capacitorless SOI-DRAM; DG-FinFET; GIDL; high speed; impact ionization; low power;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electron Devices and Solid-State Circuits, 2009. EDSSC 2009. IEEE International Conference of
  • Conference_Location
    Xi´an
  • Print_ISBN
    978-1-4244-4297-3
  • Electronic_ISBN
    978-1-4244-4298-0
  • Type

    conf

  • DOI
    10.1109/EDSSC.2009.5394198
  • Filename
    5394198