• DocumentCode
    3224486
  • Title

    PM effectiveness as a high leverage output improvement methodology

  • Author

    Saha, Sujit ; Kuppuswamy, Chandru ; Kraus, Jerry

  • Author_Institution
    Intel Corp., Santa Clara, CA, USA
  • fYear
    1995
  • fDate
    13-15 Nov 1995
  • Firstpage
    229
  • Lastpage
    231
  • Abstract
    Intel Corporation has typically increased factory output by either adding more bottleneck equipment and/or improving equipment utilization. Utilization improvements were achieved by improving availability while maintaining the same or lower gap between availability and utilization. Typical availability improvement projects would require hardware changes (e.g. faster robots, faster pumps) or process changes, both of which have some level of technology risks. Lower risks from procedural changes make it an attractive alternate path for improvements. The seed idea for this program came from another Intel Fab experience which showed that right after a scheduled PM, the unscheduled downtimes would, immediately following a PM, almost double the baseline preceding the PM. This pointed to an opportunity to understand the PM content and its relationships to the equipment reliability since the experience indicated that, during every PM some "damage" was being done to the equipment which subsequently caused the post-PM failures. Since most of the improvements came from "procedural" improvements, this methodology has the added benefits of being "low risk". The "Indy 500" Team was formed in response to the low reliability of a tool that was factory output constraints. The Team consisted of all technicians from all shifts to improve teamwork, communication and training.
  • Keywords
    management; semiconductor device manufacture; Indy 500 Team; Intel Corporation; PM procedures; availability; communication; equipment reliability; factory output; low risk methodology; semiconductor fab; teamwork; training; utilization; Continuous improvement; Costs; Educational institutions; Fixtures; Hardware; Process design; Production facilities; Robots; Scheduling; Teamwork;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Advanced Semiconductor Manufacturing Conference and Workshop, 1995. ASMC 95 Proceedings. IEEE/SEMI 1995
  • ISSN
    1078-8743
  • Print_ISBN
    0-7803-2713-6
  • Type

    conf

  • DOI
    10.1109/ASMC.1995.484376
  • Filename
    484376