Factory start-up and production ramp: yield improvement through signature analysis and visual/electrical correlation

Author

Lee, Fourmun ; Wang, Ping ; Goodner, Ray

Author_Institution

Motorola Inc., Chandler, AZ, USA

fYear

1995

fDate

13-15 Nov 1995

Firstpage

267

Lastpage

270

Abstract

Variations in defect distributions and device yield patterns can provide significant information about the performance of processes used in the fabrication of integrated circuits. This paper describes how signature analysis and visual/electrical correlation were used to identify yield loss mechanisms during the start-up and production ramp of MOS 12, Motorola´s newest 8-inch high volume wafer fab. The identification, diagnosis, and resolution of two yield issues are presented as case studies,.

Keywords

automatic optical inspection; failure analysis; integrated circuit yield; pattern recognition; production; MOS 12; Motorola high volume wafer fab; defect distributions; device yield patterns; diagnosis; fabrication; factory start-up; identification; integrated circuits; production ramp; signature analysis; visual/electrical correlation; yield improvement; yield loss mechanisms; Circuit analysis; Circuit testing; Fabrication; Information analysis; Inspection; Integrated circuit yield; Pattern analysis; Performance analysis; Production facilities; Random access memory;

fLanguage

English

Publisher

ieee

Conference_Titel

Advanced Semiconductor Manufacturing Conference and Workshop, 1995. ASMC 95 Proceedings. IEEE/SEMI 1995

ISSN

1078-8743

Print_ISBN

0-7803-2713-6

Type

conf

DOI

10.1109/ASMC.1995.484383

Filename

484383