DocumentCode :
3224837
Title :
GaN smart power chip technology
Author :
Chen, Kevin Jing
Author_Institution :
Dept. of Electron. & Comput. Eng., Hong Kong Univ. of Sci. & Technol., Kowloon, China
fYear :
2009
fDate :
25-27 Dec. 2009
Firstpage :
403
Lastpage :
407
Abstract :
Wide-bandgap GaN-based semiconductor materials are attracting considerable attention as the preferred material for power electronics applications, owning to their superior properties including high breakdown electric-field, high carrier density, high electron mobility and high saturation velocity. In this paper, the technologies for implementing GaN smart power ICs will be introduced based on the large-size, low-cost and highly scalable GaN-on-Si platform. High-voltage power components (normally-off power transistors and HEMT-compatible rectifiers) and low-voltage periphery devices for digital/analog mixed-signal circuits are successfully integrated with the same fabrication process. In particular, key analog functional blocks such as voltage reference generators and comparators are demonstrated using GaN-based technology for the first time. The optimized voltage reference generator achieved less than 70 ppm/°C drift and can be used as a reference voltage in various biasing and sensing circuits. The temperature-dependent performance of a conventional comparator is characterized and a new temperature-compensated comparator circuit is also demonstrated. The positive limiting level of the temperature-compensated comparator is less than 450 ppm/°C drift compared to 1400 ppm/°C in the conventional comparator.
Keywords :
carrier density; comparators (circuits); electric breakdown; electron mobility; gallium compounds; mixed analogue-digital integrated circuits; power integrated circuits; wide band gap semiconductors; GaN; breakdown electric-field; carrier density; digital/analog mixed-signal circuits; electron mobility; high-voltage power components; key analog functional blocks; optimized voltage reference generator; power electronics applications; reference voltage; saturation velocity; sensing circuits; smart power IC; smart power chip technology; temperature-compensated comparator circuit; wide-bandgap semiconductor materials; Charge carrier density; Electric breakdown; Electron mobility; Gallium nitride; Integrated circuit technology; Power electronics; Power integrated circuits; Semiconductor device breakdown; Semiconductor materials; Voltage; GaN; Wide Bandgap; power converter; smart power; voltage reference and planar integration;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electron Devices and Solid-State Circuits, 2009. EDSSC 2009. IEEE International Conference of
Conference_Location :
Xi´an
Print_ISBN :
978-1-4244-4297-3
Electronic_ISBN :
978-1-4244-4298-0
Type :
conf
DOI :
10.1109/EDSSC.2009.5394230
Filename :
5394230
Link To Document :
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