DocumentCode
3224956
Title
High aspect ratio metallic nanowire arrays by pulsed electrodeposition
Author
Graf, Matthias ; Eychmüller, Alexander ; Wolter, Klaus-Jürgen
Author_Institution
Electron. Packaging Lab., Tech. Univ. Dresden, Dresden, Germany
fYear
2011
fDate
15-18 Aug. 2011
Firstpage
181
Lastpage
186
Abstract
This work describes the electrochemical fabrication of high aspect ratio Ag nanowire (NW) arrays with the aim of their later application in an anisotropic conductive adhesive NW film (ACANWF). The basis for the production is the well-established electrodeposition process of Ag into pores of anodic oxidized alumina (AAO). Here, deposition was carried out in both, standard DC mode and by pulsed electrodeposition. After variation of the parameters pulse frequency, pulse and pause potential and electrolyte concentration, aspect ratios of 371 (NW length = 26 μm, NW diameter = 70 nm) could be reached within 30 min deposition time where standard DC plating shows much slower NW growth to an aspect ratio of 56. The need for higher aspect ratio NWs is discussed with respect to the construction and manageability of the ACANWF in scaled-up processes.
Keywords
adhesives; electrochemistry; electrodeposition; electrolytes; metallic thin films; nanofabrication; nanowires; porosity; porous materials; silver; voltammetry (chemical analysis); Ag; anisotropic conductive adhesive nanowire films; anodic oxidized alumina; cyclic voltammetry; electrochemical fabrication; electrolyte concentration; metallic nanowire arrays; nanowire growth; porosity; pulse frequency; pulse potential; pulsed electrodeposition; size 26 mum; size 70 nm; time 30 min; Electric potential; Filling; Films; Gold; Nonhomogeneous media; Oxidation;
fLanguage
English
Publisher
ieee
Conference_Titel
Nanotechnology (IEEE-NANO), 2011 11th IEEE Conference on
Conference_Location
Portland, OR
ISSN
1944-9399
Print_ISBN
978-1-4577-1514-3
Electronic_ISBN
1944-9399
Type
conf
DOI
10.1109/NANO.2011.6144342
Filename
6144342
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