• DocumentCode
    3225309
  • Title

    Annealing effects on structural, optical and electrical properties of Al implanted 4H-SiC

  • Author

    Zhang, Mingkun ; Huang, Jun ; Hong, Rongdun ; Chen, Xiaping ; Wu, Zhengyun

  • Author_Institution
    Dept. of Phys., Xiamen Univ., Xiamen, China
  • fYear
    2009
  • fDate
    25-27 Dec. 2009
  • Firstpage
    314
  • Lastpage
    317
  • Abstract
    Effects of Al ions implantation into n-type 4H-SiC followed by annealing at various temperatures have been studied by Atomic Force Microscopy (AFM), Raman scattering, Fourier transform infrared (FTIR) reflectance spectroscopy, and Hall effect measurements. AFM experiments observed a large amount of discontinuous strips on 4H-SiC surface running along three directions after high temperature annealing. Raman scattering and FTIR spectra jointly indicated the damage and amorphization of 4H-SiC due to Al implantation and the crystal restoration after high temperature annealing. Hall effect measurements revealed that the sample annealed at 1600°C achieved a higher activity ratio and a lower resistivity, which satisfied the application of numerous SiC-based devices.
  • Keywords
    Hall effect; Raman spectra; aluminium compounds; amorphisation; annealing; atomic force microscopy; silicon compounds; Fourier transform infrared reflectance spectroscopy; Hall effect measurements; Raman scattering; SiC-Al; amorphization; annealing effects; atomic force microscopy; crystal restoration; electrical property; optical property; structural property; temperature 1600 degC; Annealing; Atom optics; Atomic force microscopy; Atomic measurements; Force measurement; Hall effect; Infrared spectra; Raman scattering; Spectroscopy; Temperature; Al; SiC; ion implantation;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electron Devices and Solid-State Circuits, 2009. EDSSC 2009. IEEE International Conference of
  • Conference_Location
    Xi´an
  • Print_ISBN
    978-1-4244-4297-3
  • Electronic_ISBN
    978-1-4244-4298-0
  • Type

    conf

  • DOI
    10.1109/EDSSC.2009.5394252
  • Filename
    5394252