Kron simulation of field-to-line coupling using a meshed and a modified Taylor cell

Printed Circuit Board (PCB) traces play a role in the immunity of electronic products. Contrary to Integrated Circuits (ICs), the layout of PCB traces can be changed rather late in a product´s design. Therefore, it is interesting to equip the PCB designer with simple tools that predict the immunity of his PCB traces. In this article, we compare two simulations of field-to-long line coupling based on Taylor´s model. Firstly, the line is meshed into electrically short Taylor cells and numerically simulated using Kron´s method. Secondly, we use one modified Taylor cell, which does not need meshing and is a closed-form, analytical result. The two simulations turn out to be equally precise on a straight microstrip line, the meshed simulation being more flexible, the simulation using a modified Taylor cell being faster.