DocumentCode :
3225454
Title :
High power parallel plane 4H-SiC PiN diode with FP-Assisted-JTE termination
Author :
Zheng, Qingli ; Zhang, Yuming ; Zhang, Yimen
Author_Institution :
Key Lab. of Wide Band-Gap Semicond. Mater. & Devices, Xidian Univ., Xi´´an, China
fYear :
2009
fDate :
25-27 Dec. 2009
Firstpage :
334
Lastpage :
337
Abstract :
With the developing of process technology and material quality, the progress of commercializing a 4H-SiC power PiN diode has been made greatly, but for very high power 4H-SiC PiN diode, it still faces many difficult challenges. In this paper, we design a parallel plane Power 4H-SiC PiN Diode, in which ideal breakdown voltage is about 1.9kv. From numerable simulation results with ISE-TCAD software, we see that JTE termination technique can improve diode breakdown voltage. We also find that FP-Assisted-JTE termination technique can make more improvement of breakdown voltage than single JTE termination technique.
Keywords :
electric breakdown; p-i-n diodes; FP-Assisted-JTE termination technique; ISE-TCAD software; SiC; diode breakdown voltage; high power parallel plane; material quality; parallel plane 4H power PiN diode; process technology; Breakdown voltage; Commercialization; Conducting materials; Epitaxial layers; Frequency; Ionization; Semiconductor diodes; Silicon carbide; Temperature; Thermal conductivity; 4H-SiC; Diode plane; FP; JTE; PiN;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electron Devices and Solid-State Circuits, 2009. EDSSC 2009. IEEE International Conference of
Conference_Location :
Xi´an
Print_ISBN :
978-1-4244-4297-3
Electronic_ISBN :
978-1-4244-4298-0
Type :
conf
DOI :
10.1109/EDSSC.2009.5394261
Filename :
5394261
Link To Document :
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