DocumentCode :
3225482
Title :
Evolution of the native defects in unintentionally doped 4H-SiC during annealing process
Author :
Cheng, Ping ; Zhang, Yuming ; Zhang, Yimen ; Guo, Hui
Author_Institution :
Sch. of Microelectron., Xidian Univ., Xi´´an, China
fYear :
2009
fDate :
25-27 Dec. 2009
Firstpage :
322
Lastpage :
325
Abstract :
With isothermal annealing treatment at 1873 K, unintentionally doped 4H-SiC epitaxial layers grown by low-pressure chemical vapor deposition (LPCVD) have been studied using electron spin resonance (ESR) and low temperature photoluminescence (PL). ESR and PL spectra show that the native defects are the mixture of carbon vacancy (VC) and its extended point defects. The decrease of key parameter g vector is obtained from ESR spectra with annealing time prolonged. Meanwhile the full width at half maximum (FWHM) becomes wider and the peak shifts from green to yellow luminescence in PL spectra. This phenomenon results from strong interaction among the intrinsic defects during the isothermal annealing process. The interaction of native defects affects the way of native defect combination and then makes the energy level of native defects varied with annealing time changed from 10 min to 60 min.
Keywords :
annealing; chemical vapour deposition; paramagnetic resonance; photoluminescence; point defects; semiconductor growth; silicon compounds; vacancies (crystal); vapour phase epitaxial growth; wide band gap semiconductors; ESR spectra; PL spectra; SiC; annealing process; carbon vacancy; electron spin resonance; epitaxial layers grown; isothermal annealing treatment; low temperature photoluminescence; low-pressure chemical vapor deposition; temperature 1873 K; time 10 min to 60 min; yellow luminescence; Annealing; Chemical vapor deposition; Epitaxial layers; Isothermal processes; Paramagnetic resonance; Photoluminescence; Silicon carbide; Spectroscopy; Substrates; Temperature; ESR; PL spectrum; SI 4H-SiC; anneal; native defects;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electron Devices and Solid-State Circuits, 2009. EDSSC 2009. IEEE International Conference of
Conference_Location :
Xi´an
Print_ISBN :
978-1-4244-4297-3
Electronic_ISBN :
978-1-4244-4298-0
Type :
conf
DOI :
10.1109/EDSSC.2009.5394262
Filename :
5394262
Link To Document :
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