Title :
Compct UWB bandpass filter using microstrip and coplanar waveguide back-to-back coupled structure
Author :
Qian, Huizhen ; Luo, Xun ; Song, Xiangyu ; Luo, Wan ; Ma, Jian-Guo
Author_Institution :
Sch. of Electron. Eng., Univ. of Electron. Sci. & Technol. of China, Chengdu, China
Abstract :
A compact ultra-wideband (UWB) bandpass filter (BPF) using microstrip and coplanar waveguide (CPW) back-to-back coupled structure is proposed. First, the detached-mode resonator on the CPW layer is formed to allocate three resonant frequencies to meet the concern of UWB operation. Then, microstrip and CPW back-to-back coupled structure is introduced to achieve the UWB limit. To further improve the stopband performance of the proposed UWB BPF, the periodic serration resonator (PSR) on the microstrip layer is employed. The upper stopband bandwidth could be finely tuned by adjusting the coupled area of the PSRs. To verify the feasibility of the mechanism above, a filter is fabricated and tested. The measured results exhibit good performance including a small insertion loss less than 0.52 dB, good return loss below -18 dB in the midband. Specifically, the upper stopband is observed from 11.5 to 17.3 GHz, and a stopband rejection level below -21 dB.
Keywords :
band-pass filters; coplanar waveguides; microstrip filters; microstrip resonators; microwave filters; resonator filters; waveguide filters; back-to-back coupled structure; coplanar waveguides; detached-mode resonator; frequency 11.5 GHz to 17.3 GHz; microstrip filters; microwave filters; periodic serration resonator; ultra wideband bandpass filter; Band pass filters; Bandwidth; Coplanar waveguides; Loss measurement; Microstrip filters; Microstrip resonators; Resonant frequency; Resonator filters; Testing; Ultra wideband technology; Back-to-back coupled; bandpass filter (BPF); coplanar waveguide (CPW); multiple-mode resonator (MMR); periodic serration resonator (PSR); ultra-wideband (UWB);
Conference_Titel :
Electron Devices and Solid-State Circuits, 2009. EDSSC 2009. IEEE International Conference of
Conference_Location :
Xi´an
Print_ISBN :
978-1-4244-4297-3
Electronic_ISBN :
978-1-4244-4298-0
DOI :
10.1109/EDSSC.2009.5394274