Title :
1993 cumulative bibliography of articles on semiconductor thermal and temperature testing
Author_Institution :
OAI/SAGE, Milpitas, CA, USA
Abstract :
A bibliography providing information on semiconductor thermal and/or temperature characteristics, measurement techniques and results, hardware applications, and other pertinent information is provided
Keywords :
semiconductor device testing; temperature measurement; thermal analysis; bibliography; hardware applications; measurement techniques; semiconductor device testing; temperature testing; thermal testing; Bibliographies; Electronic packaging thermal management; Integrated circuit packaging; Microassembly; Microscopy; Plastic packaging; Semiconductor device reliability; Semiconductor device testing; Temperature measurement; Thermal stresses;
Conference_Titel :
Semiconductor Thermal Measurement and Management Symposium, 1993. SEMI-THERM IX., Ninth Annual IEEE
Conference_Location :
Austin, TX
Print_ISBN :
0-7803-0863-8
DOI :
10.1109/STHERM.1993.225314
