Title :
Intrinsic characteristics of thermally stable AlN Lamb wave resonators at high temperatures
Author :
Lin, Chih-Ming ; Yen, Ting-Ta ; Felmetsger, Valery V. ; Kuypers, Jan H. ; Pisano, Albert P.
Author_Institution :
Berkeley Sensor & Actuator Center, Univ. of California at Berkeley, Berkeley, CA, USA
Abstract :
The thermal compensation at high temperatures for aluminum nitride (AlN) Lamb wave resonators utilizing the lowest symmetric (S0) mode is theoretically and experimentally demonstrated in this work. The turnover temperature can be designed at high temperatures by changing the normalized AlN film thickness (hAlN/λ) and the normalized silicon oxide (SiO2) layer thickness (hSiO2/λ) in the AlN/SiO2 composite layer. The AlN Lamb wave resonators were well temperature-compensated at 214°C and 430°C, respectively, by using different ratios of hAlN/λ to hSiO2/λ. Even though the intrinsic quality factor (Q) degrades and the intrinsic motional impedance (Rm) increases at high temperatures, a Lamb wave resonator shows a Q of 760 at its turnover temperature, 430°C. These results demonstrate that thermally stable AlN Lamb wave resonators have the great potential for harsh environment applications.
Keywords :
Q-factor; aluminium compounds; composite materials; high-temperature effects; silicon compounds; surface acoustic wave resonators; thermal stability; wide band gap semiconductors; AlN-SiO2; composite layer; high-temperature effect; intrinsic motional impedance; intrinsic quality factor; lowest symmetric mode; temperature 214 degC; temperature 430 degC; thermal compensation; thermally stable Lamb wave resonators; turnover temperature; Electrodes; Frequency measurement; Resonant frequency; Temperature; Temperature measurement; Temperature sensors; Thermal stability; Aluminum Nitride; Harsh Environment; Lamb Wave Resonator; Silicon Dioxide; Thermal Compensation; Zero First-order TCF;
Conference_Titel :
Ultrasonics Symposium (IUS), 2011 IEEE International
Conference_Location :
Orlando, FL
Print_ISBN :
978-1-4577-1253-1
DOI :
10.1109/ULTSYM.2011.0515