Title :
Methodology for the thermal characterization of the MQUAD microelectronic package
Author :
Guenin, Bruce M. ; Mahulikar, Deepak
Author_Institution :
Olin Corp., New Haven, CT, USA
Abstract :
Experimental and mathematical modeling techniques which were developed to characterize the thermal performance of MQUAD packages are described. The situation characterized is one of natural convection, with the package attached to a test board. The techniques described take advantage of the unique construction of the MQUAD package in order to achieve relative simplicity in their execution. Due to its low internal thermal resistance and efficient thermal coupling to the circuit board, the thermal behavior of the MQUAD package is dominated by the convective heat transfer coefficient and the thermal conductivity of the circuit board
Keywords :
convection; cooling; packaging; thermal resistance; MQUAD microelectronic package; internal thermal resistance; natural convection; test board; thermal characterization; thermal conductivity; thermal coupling; thermal performance; Circuit testing; Conductivity measurement; Heat transfer; Integrated circuit packaging; Integrated circuit technology; Microelectronics; Printed circuits; Thermal conductivity; Thermal resistance; Vents;
Conference_Titel :
Semiconductor Thermal Measurement and Management Symposium, 1993. SEMI-THERM IX., Ninth Annual IEEE
Conference_Location :
Austin, TX
Print_ISBN :
0-7803-0863-8
DOI :
10.1109/STHERM.1993.225316
