DocumentCode
3225893
Title
Study on electrical characteristics of amorphous InGaZnO MOS capacitors with High κ HfOx Ny gate dielectric
Author
Tong, Xingsheng ; Zou, Xiao
Author_Institution
Dept. of Electromachine Eng., Jianghan Univ., Wuhan, China
fYear
2009
fDate
25-27 Dec. 2009
Firstpage
213
Lastpage
216
Abstract
High κ HfOxNy gate dielectric film is deposited on amorphous InGaZnO (a-IGZO) by radio frequency reactive sputtering HfO2 target in N2 ambient. The κ-value is approximately 1.5 times higher than pure HfO2 owing to the existence of Hf-N bond. The results of SIMS, AFM and electrical properties measurement also indicate that nitrogen incorporation into HfO2 ameliorate the surface morphology of dielectric film, suppress the atom diffusion at the interface, reduce the hysteresis, decrease the gate leakage current, thus enhance device performance.
Keywords
MOS capacitors; amorphous semiconductors; atomic force microscopy; dielectric hysteresis; high-k dielectric thin films; leakage currents; secondary ion mass spectra; sputtering; surface morphology; AFM; HfON; InGaZnO; N2; SIMS; amorphous MOS capacitors; atom diffusion; electrical characteristics; electrical properties measurement; gate leakage current; high κ gate dielectric film; hysteresis; nitrogen incorporation; radio frequency reactive sputtering; surface morphology; Amorphous materials; Atomic measurements; Bonding; Current measurement; Dielectric films; Electric variables; Hafnium oxide; MOS capacitors; Radio frequency; Sputtering; HfOx Ny ; MOS capacitors; amorphous InGaZnO;
fLanguage
English
Publisher
ieee
Conference_Titel
Electron Devices and Solid-State Circuits, 2009. EDSSC 2009. IEEE International Conference of
Conference_Location
Xi´an
Print_ISBN
978-1-4244-4297-3
Electronic_ISBN
978-1-4244-4298-0
Type
conf
DOI
10.1109/EDSSC.2009.5394280
Filename
5394280
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