DocumentCode :
3225901
Title :
Correlation of experimental data with analytical predictions for GaAs FET in MMIC transmitter module in a subarray
Author :
Ibrahim, M.S. ; Paradis, L.R.
Author_Institution :
Raytheon Co., Tewksbury, MA, USA
fYear :
1993
fDate :
2-4 Feb 1993
Firstpage :
160
Lastpage :
165
Abstract :
Under the microwave/millimeter-wave monolithic integrated circuit (MIMIC) Phase 1 DARPA sponsored development program, a comprehensive integrated finite element model of a transmitter module which is based on MMIC technology was developed and exercised. This model determined FET channel temperature sensitivity to system and/or chip level design variations. Module thermal measurements were taken during operation of a brassboard assembly, and the results were compared with the predictions. These showed excellent agreement, validating the model and the approach. The authors describe the tests and compare the experimental and analytical results
Keywords :
III-V semiconductors; MMIC; field effect transistors; finite element analysis; gallium arsenide; semiconductor device models; FET; FET channel temperature; GaAs; MIMIC; MMIC transmitter module; brassboard assembly; chip level design variations; integrated finite element model; thermal measurements; Data analysis; Finite element methods; Integrated circuit modeling; Integrated circuit technology; MIMICs; MMICs; Microwave FETs; Microwave technology; Temperature sensors; Transmitters;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Semiconductor Thermal Measurement and Management Symposium, 1993. SEMI-THERM IX., Ninth Annual IEEE
Conference_Location :
Austin, TX
Print_ISBN :
0-7803-0863-8
Type :
conf
DOI :
10.1109/STHERM.1993.225318
Filename :
225318
Link To Document :
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