• DocumentCode
    3226154
  • Title

    Extended necrosis by using dual-curved therapeutic transducer for noninvasive HIFU surgery

  • Author

    Jeong, Jong Seob ; Cannata, Jonathan Matthew ; Shung, K. Kirk

  • Author_Institution
    Dept. of Med. Biotechnol., Dongguk Univ. - Seoul, Seoul, South Korea
  • fYear
    2011
  • fDate
    18-21 Oct. 2011
  • Firstpage
    2321
  • Lastpage
    2324
  • Abstract
    In noninvasive HIFU (High Intensity Focused Ultrasound) surgery, a treatment time can be reduced by using a therapeutic transducer capable of enlarging a coagulated lesion per sonication. Currently, most of studies have been focused on the expansion of necrosis in the lateral direction than the axial direction. In this paper, we present a novel HIFU transducer with a dual curved aperture which can extend DOF (Depth of Focus) resulting in a broad necrotic region in the axial direction. A prototype dual-curved transducer was fabricated and its performance was successfully tested by conducting simulation of bioheat transfer/thermal dose, hydrophone measurement, and in vitro test with a beef liver. Although several design parameters for the transducer were not optimized, the DOF of the proposed method was 3.5 times larger than that of the conventional single element transducer with the same dimension. Thus, the dual-curved therapeutic transducer may be a potential method to reduce treatment time of HIFU surgery.
  • Keywords
    biomedical transducers; biothermics; coagulation; diseases; dosimetry; liver; radiation therapy; surgery; ultrasonic therapy; beef liver; bioheat transfer-thermal dose; coagulated lesion; conventional single element transducer; dual curved aperture; dual-curved therapeutic transducer; extend depth-of-focus; hydrophone measurement; necrosis; noninvasive high-intensity focused ultrasound surgery; sonication; Acoustics; Lesions; Liver; Prototypes; Sonar equipment; Transducers; Ultrasonic imaging;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Ultrasonics Symposium (IUS), 2011 IEEE International
  • Conference_Location
    Orlando, FL
  • ISSN
    1948-5719
  • Print_ISBN
    978-1-4577-1253-1
  • Type

    conf

  • DOI
    10.1109/ULTSYM.2011.0576
  • Filename
    6293210