• DocumentCode
    3226178
  • Title

    Mixed-level modeling for network on chip infrastructure in SoC design

  • Author

    Hu, Yang ; Yin, Shouyi ; Liu, Leibo ; Wei, Shaojun

  • Author_Institution
    Inst. of Microelectron., Tsinghua Univ., Beijing, China
  • fYear
    2010
  • fDate
    6-9 Dec. 2010
  • Firstpage
    911
  • Lastpage
    914
  • Abstract
    We present a concise, fast, accurate, efficient mixed-level full-system based realistic application-oriented simulation platform in this paper which aims to evaluate the cycle-accurate behavior of interconnection component thus help developers to explore more optimized NoC architecture. A trace-driven transaction-level simulation environment is built to get realistic traffic patterns for interconnection. We design wrappers to translate the transaction-level traffic patterns into cycle-accurate flits. We implement routers at cycle-accurate level which use fixed five-step pipeline architectures pursuing more details in design, while implement peripherals (IP cores) at transaction-level following TLM 2.0 standard. Due to we only need to focus on the performance of interested part, that is the interconnection, under the premise of keeping the accuracy of interconnection simulation, the utilization of transaction-level models makes the peripheral modeling in full-system simulation environment more efficient, lightweight, configurable and scalable.
  • Keywords
    circuit simulation; multiprocessor interconnection networks; network routing; network-on-chip; pipeline processing; NoC architecture; SoC design; TLM 2.0 standard; cycle-accurate flits; fixed five-step pipeline architecture; interconnection component behavior; interconnection traffic pattern; mixed-level full-system based realistic application-oriented simulation; mixed-level modeling; network-on-chip; router implemention; trace-driven transaction-level simulation; transaction-level traffic pattern; Adaptation model; Engines; Payloads; Routing; Sockets; System-on-a-chip; Traffic control; Mixed-level modeling; NoC; TLM;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Circuits and Systems (APCCAS), 2010 IEEE Asia Pacific Conference on
  • Conference_Location
    Kuala Lumpur
  • Print_ISBN
    978-1-4244-7454-7
  • Type

    conf

  • DOI
    10.1109/APCCAS.2010.5774752
  • Filename
    5774752