DocumentCode
3226178
Title
Mixed-level modeling for network on chip infrastructure in SoC design
Author
Hu, Yang ; Yin, Shouyi ; Liu, Leibo ; Wei, Shaojun
Author_Institution
Inst. of Microelectron., Tsinghua Univ., Beijing, China
fYear
2010
fDate
6-9 Dec. 2010
Firstpage
911
Lastpage
914
Abstract
We present a concise, fast, accurate, efficient mixed-level full-system based realistic application-oriented simulation platform in this paper which aims to evaluate the cycle-accurate behavior of interconnection component thus help developers to explore more optimized NoC architecture. A trace-driven transaction-level simulation environment is built to get realistic traffic patterns for interconnection. We design wrappers to translate the transaction-level traffic patterns into cycle-accurate flits. We implement routers at cycle-accurate level which use fixed five-step pipeline architectures pursuing more details in design, while implement peripherals (IP cores) at transaction-level following TLM 2.0 standard. Due to we only need to focus on the performance of interested part, that is the interconnection, under the premise of keeping the accuracy of interconnection simulation, the utilization of transaction-level models makes the peripheral modeling in full-system simulation environment more efficient, lightweight, configurable and scalable.
Keywords
circuit simulation; multiprocessor interconnection networks; network routing; network-on-chip; pipeline processing; NoC architecture; SoC design; TLM 2.0 standard; cycle-accurate flits; fixed five-step pipeline architecture; interconnection component behavior; interconnection traffic pattern; mixed-level full-system based realistic application-oriented simulation; mixed-level modeling; network-on-chip; router implemention; trace-driven transaction-level simulation; transaction-level traffic pattern; Adaptation model; Engines; Payloads; Routing; Sockets; System-on-a-chip; Traffic control; Mixed-level modeling; NoC; TLM;
fLanguage
English
Publisher
ieee
Conference_Titel
Circuits and Systems (APCCAS), 2010 IEEE Asia Pacific Conference on
Conference_Location
Kuala Lumpur
Print_ISBN
978-1-4244-7454-7
Type
conf
DOI
10.1109/APCCAS.2010.5774752
Filename
5774752
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