DocumentCode :
3226221
Title :
Am29000 thermal evaluation in laser beam printer applications, in-system real-time measurements for ICC and power calculations
Author :
Disko, David ; Durand, Joe
Author_Institution :
Advanced Micro Devices Inc., Austin, TX, USA
fYear :
1993
fDate :
2-4 Feb 1993
Firstpage :
35
Lastpage :
41
Abstract :
A method for measuring the case temperature of Am29000 while it is operating in a laser beam printer is described. The method involves using a portable data logging system with fine gauge thermocouples to collect the data and the use of statistical techniques to analyze the data. Potential pitfalls such as airflow effects, thermocouple attachment methods, software test cases and data correlation are addressed. Techniques for conversion of measured temperatures into power calculations are included along with data from three laser beam printers
Keywords :
data loggers; laser printers; microprocessor chips; temperature measurement; thermocouples; Am29000; airflow effects; attachment methods; case temperature; data correlation; fine gauge thermocouples; laser beam printer applications; microprocessor chips; portable data logging system; power calculations; software test cases; statistical techniques; Integrated circuit packaging; Laser applications; Laser beams; Packaging machines; Power measurement; Printers; Real time systems; Temperature measurement; Testing; Thermal resistance;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Semiconductor Thermal Measurement and Management Symposium, 1993. SEMI-THERM IX., Ninth Annual IEEE
Conference_Location :
Austin, TX
Print_ISBN :
0-7803-0863-8
Type :
conf
DOI :
10.1109/STHERM.1993.225333
Filename :
225333
Link To Document :
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