Am29000 thermal evaluation in laser beam printer applications, in-system real-time measurements for ICC and power calculations

Author

Disko, David ; Durand, Joe

Author_Institution

Advanced Micro Devices Inc., Austin, TX, USA

fYear

1993

fDate

2-4 Feb 1993

Firstpage

35

Lastpage

41

Abstract

A method for measuring the case temperature of Am29000 while it is operating in a laser beam printer is described. The method involves using a portable data logging system with fine gauge thermocouples to collect the data and the use of statistical techniques to analyze the data. Potential pitfalls such as airflow effects, thermocouple attachment methods, software test cases and data correlation are addressed. Techniques for conversion of measured temperatures into power calculations are included along with data from three laser beam printers

Keywords

data loggers; laser printers; microprocessor chips; temperature measurement; thermocouples; Am29000; airflow effects; attachment methods; case temperature; data correlation; fine gauge thermocouples; laser beam printer applications; microprocessor chips; portable data logging system; power calculations; software test cases; statistical techniques; Integrated circuit packaging; Laser applications; Laser beams; Packaging machines; Power measurement; Printers; Real time systems; Temperature measurement; Testing; Thermal resistance;

fLanguage

English

Publisher

ieee

Conference_Titel

Semiconductor Thermal Measurement and Management Symposium, 1993. SEMI-THERM IX., Ninth Annual IEEE

Conference_Location

Austin, TX

Print_ISBN

0-7803-0863-8

Type

conf

DOI

10.1109/STHERM.1993.225333

Filename

225333