• DocumentCode
    3226310
  • Title

    Ninth Annual IEEE Semiconductor Thermal Measurement and Management Symposium (Cat. No.93CH3226-8)

  • fYear
    1993
  • fDate
    2-4 Feb. 1993
  • Abstract
    The following topics are dealt with: multichip module thermal management; system thermal characterization; thermal modeling techniques and applications; advances in thermal measurements; general thermal characterization; and component thermal characterization
  • Keywords
    integrated circuit testing; multichip modules; packaging; semiconductor device models; temperature measurement; thermal analysis; component thermal characterization; multichip module thermal management; system thermal characterization; thermal characterization; thermal measurements; thermal modeling techniques;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Semiconductor Thermal Measurement and Management Symposium, 1993. SEMI-THERM IX., Ninth Annual IEEE
  • Conference_Location
    Austin, TX, USA
  • Print_ISBN
    0-7803-0863-8
  • Type

    conf

  • DOI
    10.1109/STHERM.1993.225338
  • Filename
    225338