DocumentCode
3226310
Title
Ninth Annual IEEE Semiconductor Thermal Measurement and Management Symposium (Cat. No.93CH3226-8)
fYear
1993
fDate
2-4 Feb. 1993
Abstract
The following topics are dealt with: multichip module thermal management; system thermal characterization; thermal modeling techniques and applications; advances in thermal measurements; general thermal characterization; and component thermal characterization
Keywords
integrated circuit testing; multichip modules; packaging; semiconductor device models; temperature measurement; thermal analysis; component thermal characterization; multichip module thermal management; system thermal characterization; thermal characterization; thermal measurements; thermal modeling techniques;
fLanguage
English
Publisher
ieee
Conference_Titel
Semiconductor Thermal Measurement and Management Symposium, 1993. SEMI-THERM IX., Ninth Annual IEEE
Conference_Location
Austin, TX, USA
Print_ISBN
0-7803-0863-8
Type
conf
DOI
10.1109/STHERM.1993.225338
Filename
225338
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