• DocumentCode
    3227420
  • Title

    Research of LTCC millimeter-wave T/R module

  • Author

    Kewei, Qian

  • Author_Institution
    UESTC, Chengdu, China
  • fYear
    2010
  • fDate
    8-11 May 2010
  • Firstpage
    1444
  • Lastpage
    1446
  • Abstract
    Low-Temperature Co-fired Ceramic (LTCC) technology is one type of Co-fired ceramic multi-chip module (MCM-C), which is a high-integration and multilayer- printed packaging technology. In this paper, a millimeter-wave T/R module was presented with a very compact module size of 55×13 ×10mm3 and an extremely low weight of only 31 grams by this technology, its output power was greater than 30dBm. Besides, the optimum EMC design and technology of embedded passive components were used.
  • Keywords
    antenna theory; ceramic packaging; millimetre wave devices; phased array radar; EMC design; LTCC millimeter-wave T/R module; co-fired ceramic multichip module; embedded passive components; gain 30 dB; low-temperature co-fired ceramic technology; millimeter wave phased array radar; multilayer-printed packaging technology; Integrated circuit interconnections; Microstrip; Millimeter wave circuits; Millimeter wave radar; Millimeter wave technology; Packaging; Phased arrays; Radar antennas; Stripline; Switches;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Microwave and Millimeter Wave Technology (ICMMT), 2010 International Conference on
  • Conference_Location
    Chengdu
  • Print_ISBN
    978-1-4244-5705-2
  • Type

    conf

  • DOI
    10.1109/ICMMT.2010.5524753
  • Filename
    5524753
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=3227420