• DocumentCode
    322765
  • Title

    EMI evaluation and hardening-a systems approach

  • Author

    Chakravarti, Bhudeb

  • Author_Institution
    EMI/EMC Centre, Hyderabad, India
  • fYear
    1997
  • fDate
    3-5 Dec 1997
  • Firstpage
    209
  • Lastpage
    212
  • Abstract
    Electromagnetic compatibility (EMC) has become a major thrust in the industries who are involved in export of electronic goods. As per the latest European norms, all electronic goods exported to the European market has to clear EMC requirements. In absence of any legislation in India, the industries in India are lacking any systematic approach to make their product compatible to EMI. Due to this reason, quick-fix methods are being used to solve the problems which are encountered during EMI testing of their products. This process is time consuming and expensive. The industries can cut their expenses if they follow a systems approach to EMC which will make their system EMI free. This paper discusses a systematic approach which the designers should follow in the design stage itself to make their product less prone to EMI. The paper also describes guidelines to be followed during mechanical design and in the manufacturing stage
  • Keywords
    commerce; electromagnetic compatibility; electromagnetic interference; electronic equipment manufacture; electronic equipment testing; radiation hardening (electronics); EMC; EMI evaluation; EMI hardening; EMI testing; European market; European norms; India; electromagnetic compatibility; electronic goods; equipment manufacture; export; legislation; mechanical design; quick-fix methods; systems approach; Consumer electronics; Electromagnetic compatibility; Electromagnetic compatibility and interference; Electromagnetic interference; Electronics industry; Guidelines; Industrial electronics; Legislation; Pulp manufacturing; Testing;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electromagnetic Interference and Compatibility '97. Proceedings of the International Conference on
  • Conference_Location
    Hyderabad
  • Print_ISBN
    81-900652-0-3
  • Type

    conf

  • DOI
    10.1109/ICEMIC.1997.669799
  • Filename
    669799