DocumentCode
322767
Title
Electroless techniques for EMI shieldings
Author
Bhatgadde, L.G. ; Joseph, S.
Author_Institution
Adv. Centre for Res. in Electron., Indian Inst. of Technol., Mumbai, India
fYear
1997
fDate
3-5 Dec 1997
Firstpage
443
Lastpage
445
Abstract
This paper discusses the progress made in electroless plating techniques for fabrication of EMI shieldings. Although, there are alternative techniques such as zinc arc spray, Cu or Ni conductive paints and RF/magnetron sputtering for deposition of conductive coatings on plastics, electroless techniques have advantage of better uniformity and adhesivity of coatings as well as higher shielding effectiveness. However, these techniques have disadvantages in respect of limited bath life and hazardous chemicals. It is suggested that if these problems are addressed jointly by academicians, industry and suppliers, these techniques can be widely used for the manufacture of EMI shieldings
Keywords
electroless deposition; electromagnetic shielding; plastics; Cu; EMI shielding manufacture; Ni; RF/magnetron sputtering; Zn; adhesion; conductive coatings deposition; conductive paints; electroless plating techniques; fabrication; hazardous chemicals; industry; limited bath life; plastics; shielding effectiveness; suppliers; zinc arc spray; Coatings; Electromagnetic interference; Fabrication; Magnetic shielding; Paints; Plastics; Radio frequency; Spraying; Sputtering; Zinc;
fLanguage
English
Publisher
ieee
Conference_Titel
Electromagnetic Interference and Compatibility '97. Proceedings of the International Conference on
Conference_Location
Hyderabad
Print_ISBN
81-900652-0-3
Type
conf
DOI
10.1109/ICEMIC.1997.669846
Filename
669846
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