DocumentCode :
322767
Title :
Electroless techniques for EMI shieldings
Author :
Bhatgadde, L.G. ; Joseph, S.
Author_Institution :
Adv. Centre for Res. in Electron., Indian Inst. of Technol., Mumbai, India
fYear :
1997
fDate :
3-5 Dec 1997
Firstpage :
443
Lastpage :
445
Abstract :
This paper discusses the progress made in electroless plating techniques for fabrication of EMI shieldings. Although, there are alternative techniques such as zinc arc spray, Cu or Ni conductive paints and RF/magnetron sputtering for deposition of conductive coatings on plastics, electroless techniques have advantage of better uniformity and adhesivity of coatings as well as higher shielding effectiveness. However, these techniques have disadvantages in respect of limited bath life and hazardous chemicals. It is suggested that if these problems are addressed jointly by academicians, industry and suppliers, these techniques can be widely used for the manufacture of EMI shieldings
Keywords :
electroless deposition; electromagnetic shielding; plastics; Cu; EMI shielding manufacture; Ni; RF/magnetron sputtering; Zn; adhesion; conductive coatings deposition; conductive paints; electroless plating techniques; fabrication; hazardous chemicals; industry; limited bath life; plastics; shielding effectiveness; suppliers; zinc arc spray; Coatings; Electromagnetic interference; Fabrication; Magnetic shielding; Paints; Plastics; Radio frequency; Spraying; Sputtering; Zinc;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electromagnetic Interference and Compatibility '97. Proceedings of the International Conference on
Conference_Location :
Hyderabad
Print_ISBN :
81-900652-0-3
Type :
conf
DOI :
10.1109/ICEMIC.1997.669846
Filename :
669846
Link To Document :
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