• DocumentCode
    322767
  • Title

    Electroless techniques for EMI shieldings

  • Author

    Bhatgadde, L.G. ; Joseph, S.

  • Author_Institution
    Adv. Centre for Res. in Electron., Indian Inst. of Technol., Mumbai, India
  • fYear
    1997
  • fDate
    3-5 Dec 1997
  • Firstpage
    443
  • Lastpage
    445
  • Abstract
    This paper discusses the progress made in electroless plating techniques for fabrication of EMI shieldings. Although, there are alternative techniques such as zinc arc spray, Cu or Ni conductive paints and RF/magnetron sputtering for deposition of conductive coatings on plastics, electroless techniques have advantage of better uniformity and adhesivity of coatings as well as higher shielding effectiveness. However, these techniques have disadvantages in respect of limited bath life and hazardous chemicals. It is suggested that if these problems are addressed jointly by academicians, industry and suppliers, these techniques can be widely used for the manufacture of EMI shieldings
  • Keywords
    electroless deposition; electromagnetic shielding; plastics; Cu; EMI shielding manufacture; Ni; RF/magnetron sputtering; Zn; adhesion; conductive coatings deposition; conductive paints; electroless plating techniques; fabrication; hazardous chemicals; industry; limited bath life; plastics; shielding effectiveness; suppliers; zinc arc spray; Coatings; Electromagnetic interference; Fabrication; Magnetic shielding; Paints; Plastics; Radio frequency; Spraying; Sputtering; Zinc;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electromagnetic Interference and Compatibility '97. Proceedings of the International Conference on
  • Conference_Location
    Hyderabad
  • Print_ISBN
    81-900652-0-3
  • Type

    conf

  • DOI
    10.1109/ICEMIC.1997.669846
  • Filename
    669846