• DocumentCode
    3228078
  • Title

    Is AlN/Sapphire bilayer structure an alternative to langasite for ultra-high-temperature SAW applications?

  • Author

    Aubert, Thierry ; Elmazria, Omar ; Bardong, Jochen ; Bruckner, Gudrun ; Assouar, Badreddine

  • Author_Institution
    Inst. Jean Lamour, Nancy Univ., Vandoeuvre-lès-Nancy, France
  • fYear
    2011
  • fDate
    18-21 Oct. 2011
  • Firstpage
    2082
  • Lastpage
    2085
  • Abstract
    This paper explores the potentiality to use AlN/sapphire structure as alternative piezoelectric material to langasite (LGS) for high-temperature SAW applications. In situ SAW measurements performed in vacuum up to 1050°C attest that AlN/Sapphire is more stable than LGS in such conditions. While in the case of LGS, the signal is completely lost after 8 hours at 1050°C, the device based on AlN/sapphire stays alive for 60 hours at this extreme temperature. Moreover, the degradation is attributed not to AlN but to the agglomeration phenomena undergone by the Iridium IDTs. The AlN/Sapphire structure shows also, between room temperature and at least 1050°C, a great sensitivity to temperature as well as a good linearity, which is very suitable for temperature sensor applications.
  • Keywords
    III-V semiconductors; aluminium compounds; high-temperature effects; interdigital transducers; iridium; piezoelectric materials; piezoelectricity; sapphire; surface acoustic waves; titanium; wide band gap semiconductors; Ir-Ti-AlN-Al2O3; bilayer structure; iridium IDT; langasite; piezoelectric material; temperature 20 degC to 1050 degC; temperature sensor application; time 60 hour; time 8 hour; ultrahigh-temperature SAW application; Delay lines; Films; Substrates; Surface acoustic wave devices; Surface acoustic waves; Temperature measurement; Temperature sensors;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Ultrasonics Symposium (IUS), 2011 IEEE International
  • Conference_Location
    Orlando, FL
  • ISSN
    1948-5719
  • Print_ISBN
    978-1-4577-1253-1
  • Type

    conf

  • DOI
    10.1109/ULTSYM.2011.0516
  • Filename
    6293309