DocumentCode :
3228148
Title :
Ultrathin titanium passive devices fabrication
Author :
Ecoffey, Serge ; Morissette, J.-F. ; Jedidi, N. ; Guilmain, Marc ; Nauenheim, C. ; Drouin, Dominique
Author_Institution :
Nanofabrication & Nanocharacterization Res. Center (CRN2), Univ. de Sherbrooke, Sherbrooke, QC, Canada
fYear :
2011
fDate :
15-18 Aug. 2011
Firstpage :
1689
Lastpage :
1692
Abstract :
This paper presents physical and electrical characterizations of fabricated ultrathin titanium passive devices embedded in silicon dioxide. The nanowires and Ti/TiO2/Ti metal-insulator-metal capacitors are fabricated with a flexible process based on a nanodamascene technology. A model of the titanium resistivity versus thickness based on experimental data is proposed. The combination of the nanodamascene technology and resistance modeling allows the realization of ultrathin titanium passive devices with variable geometries and/or material through a tailored chemical mechanical planarization.
Keywords :
MIM devices; passive networks; titanium; Ti-TiO2-Ti; chemical mechanical planarization; electrical characterization; metal-insulator-metal capacitors; nanodamascene technology; nanowires; physical characterization; resistance modeling; silicon dioxide; titanium resistivity; ultrathin titanium passive devices fabrication; Conductivity; Fabrication; Films; Planarization; Resistance; Titanium; chemical mechanical planarization; passive devices; resistivity; titanium;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Nanotechnology (IEEE-NANO), 2011 11th IEEE Conference on
Conference_Location :
Portland, OR
ISSN :
1944-9399
Print_ISBN :
978-1-4577-1514-3
Electronic_ISBN :
1944-9399
Type :
conf
DOI :
10.1109/NANO.2011.6144494
Filename :
6144494
Link To Document :
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