Photonics for Z-axis stacking of multi-chip modules

Author

Carson, R.F. ; Lovejoy, M.L. ; Lear, K.L. ; Warren, M.E. ; Blum, O. ; Seigal, P.K. ; Craft, D.C. ; Kilcoyne, S.P. ; Patrizi, G.A.

Author_Institution

Sandia Nat. Labs., Albuquerque, NM, USA

Volume

2

fYear

1995

fDate

30 Oct-2 Nov 1995

Firstpage

125

Abstract

The device designs used for this work are based on highly efficient vertical-cavity surface emitting lasers, connected to corresponding photoreceivers. In order to meet the constraints of packaging, the optical system used in the design is implemented by the integration of microlenses into the laser and photoreceiver substrates

Keywords

integrated optoelectronics; laser cavity resonators; lenses; multichip modules; optical interconnections; optical receivers; semiconductor device packaging; semiconductor lasers; substrates; surface emitting lasers; GaAs; Z-axis stacking; device design; highly efficient vertical-cavity surface emitting lasers; laser substrates; microlens integration; multi-chip modules; optical system design; packaging; photonics; photoreceiver substrates; photoreceivers; Integrated optics; Lenses; Microoptics; Optical design; Packaging; Photonics; Stacking; Stimulated emission; Surface emitting lasers; Vertical cavity surface emitting lasers;

fLanguage

English

Publisher

ieee

Conference_Titel

Lasers and Electro-Optics Society Annual Meeting, 1995. 8th Annual Meeting Conference Proceedings, Volume 1., IEEE

Conference_Location

San Francisco, CA

Print_ISBN

0-7803-2450-1

Type

conf

DOI

10.1109/LEOS.1995.484628

Filename

484628