Title :
Miniaturized hybrid ring coupler using fan-shaped apertures on the ground plane
Author :
Chen, Peng ; Li, Zhong-Yun
Author_Institution :
Inst. of Electron. Eng., China Acad. of Eng. Phys., Mianyang, China
Abstract :
A novel hybrid ring coupler is proposed for circuit miniaturization in this paper. The coupler is constructed on a substrate of high dielectric constant, and multiple open stubs are connected on the inside of the ring for the purpose of size reduction. To achieve high characteristic impedance of the main lines in limited fabrication tolerance, fan-shaped apertures are formed on the ground plane underneath the relative wide microstrip conductors in the center. The size of the ring coupler is one third of the conventional one, solving the problem that ring coupler area shrink factor can not be very small for substrate of high dielectric constant in many papers. The design method is validated by simulation results.
Keywords :
coupled circuits; microwave devices; substrates; circuit miniaturization; fan-shaped apertures; ground plane; high characteristic impedance; high dielectric constant; miniaturized hybrid ring coupler; multiple open stubs; relative wide microstrip conductors; ring coupler area shrink factor; size reduction; substrate; Apertures; Circuit simulation; Coupling circuits; Design methodology; Dielectric substrates; Distributed parameter circuits; High-K gate dielectrics; Impedance; Microstrip; Power transmission lines;
Conference_Titel :
Microwave and Millimeter Wave Technology (ICMMT), 2010 International Conference on
Conference_Location :
Chengdu
Print_ISBN :
978-1-4244-5705-2
DOI :
10.1109/ICMMT.2010.5524801
