Title :
Flip chip assembly on rigid organic laminates: A production ready process for automotive electronics
Author :
Witty, Michael R. ; Sellers, Robin L. ; Rosson, James R. ; Walker, Geoff G. ; Meehan, Michael P. ; Vadas, Robert L. ; Ward, Aniel K.
Author_Institution :
Delphi Delco Electron. Syst., Kokomo, IN, USA
Abstract :
In a succession of statistically designed experiments, simple material screening tests and product-specific mechanical emulators were employed to demonstrate enabling technologies that result in reliable processes for the attachment of flip chips to rigid organic printed-circuit boards for application in automotive electronic controllers. Investigations focused on the effects of critical process and design parameters on solder joint reliability. During the course of this multi-year effort, investigators assessed the system performance of numerous underfill epoxies, flux chemistries, cleaning agents, solder mask materials, and laminate constructions. More than 280 materials and assembly process combinations were evaluated. Results indicate that flip chip survivability in automotive environments is strongly dependent upon combined materials interactions and that reliability is system dependent. Furthermore, several flip chip assembly processes exceed system reliability requirements for automotive applications
Keywords :
automotive electronics; circuit reliability; controllers; design of experiments; flip-chip devices; integrated circuit packaging; printed circuit manufacture; printed circuit testing; production testing; soldering; surface cleaning; automotive applications; automotive electronic controllers; automotive electronics; automotive environments; cleaning agents; critical design parameters; critical process parameters; enabling technologies; flip chip assembly; flip chip assembly processes; flip chip survivability; flip chips; flux chemistries; laminate constructions; material screening tests; materials interactions; materials/assembly process combinations; product-specific mechanical emulators; production ready process; reliable processes; rigid organic laminates; rigid organic printed-circuit boards; solder joint reliability; solder mask materials; statistically designed experiments; system dependent reliability; system performance; system reliability; underfill epoxies; Assembly; Automotive electronics; Electronic equipment testing; Flip chip; Laminates; Materials reliability; Materials testing; Organic materials; Process design; Production;
Conference_Titel :
Multichip Modules and High Density Packaging, 1998. Proceedings. 1998 International Conference on
Conference_Location :
Denver, CO
Print_ISBN :
0-7803-4850-8
DOI :
10.1109/ICMCM.1998.670756
