Title :
Simulation and optimization of MCM interconnections
Author :
Feng, Wu-Shiung ; Tenqchen, Shing ; Chen, Ming-chi
Author_Institution :
Dept. of Electr. Eng., Nat. Taiwan Univ., Taipei, Taiwan
Abstract :
In this work, we develop a dedicated simulation system to analyze MCM interconnection networks and help the package designers to find the optimal design. This simulation system consists of three parts, namely, parameter calculator, circuit simulator, and circuit optimizer. The parameter calculator evaluates the transmission-line parameters of interconnections. These parameters are fed into the circuit simulator to determine the time-domain response of an MCM interconnection network. If the circuit response does not satisfy the performance specifications, the circuit optimizer can help us to find the optimal geometric parameters of interconnections
Keywords :
circuit CAD; circuit analysis computing; circuit optimisation; integrated circuit design; integrated circuit interconnections; integrated circuit packaging; multichip modules; time-domain analysis; transmission line theory; MCM interconnection network; MCM interconnection networks; MCM interconnections; circuit optimizer; circuit response; circuit simulator; dedicated simulation system; interconnect transmission-line parameters; optimal design; optimal interconnect geometric parameters; optimization; package design; parameter calculator; performance specifications; simulation; time-domain response; Circuit simulation; Equations; Integrated circuit interconnections; Multiconductor transmission lines; Multiprocessor interconnection networks; Packaging; Time domain analysis; Transmission line discontinuities; Transmission line matrix methods; Transmission lines;
Conference_Titel :
Multichip Modules and High Density Packaging, 1998. Proceedings. 1998 International Conference on
Conference_Location :
Denver, CO
Print_ISBN :
0-7803-4850-8
DOI :
10.1109/ICMCM.1998.670776
