• DocumentCode
    3229426
  • Title

    Design of microfabricated strain gauge array to monitor bone deformation in vitro and in vivo

  • Author

    Yang, Gloria Y. ; Bailey, Vasudev J. ; Lin, Gisela ; Tang, William C. ; Keyak, Joyce H.

  • Author_Institution
    Dept. of Electr. Eng. & Comput. Sci., California Univ., Irvine, CA, USA
  • fYear
    2004
  • fDate
    19-21 May 2004
  • Firstpage
    30
  • Lastpage
    37
  • Abstract
    We present the design of a strain gauge embedded in polydimethylsiloxane (PDMS) that could be implanted and used for monitoring strain on surfaces of bones with high resolution. Our ultimate goal is to design and fabricate the device such that it could be used to provide real-time data of strain development in live subject. We have simulated the mechanical characteristics of thin-film metal strain gauges embedded in a flexible substrate made from polydimethyl-siloxane (PDMS) with various loading conditions using ANSYS® finite element analysis tool. Various gauge designs were subjected to stresses from several different directions. Linear relationships between fractional change of resistance and nominal resistance were found for both tensile and compressive stress applied on the gauges. Most significantly, the simulation demonstrated that external stresses were effectively transmitted through the PDMS layer to the thin-film metal, validating our approach.
  • Keywords
    biomechanics; bone; deformation; finite element analysis; microsensors; polymers; prosthetics; strain gauges; strain sensors; ANSYS; bone deformation monitoring; compressive stress; finite element analysis; in vitro monitoring; in vivo monitoring; microfabricated strain gauge array; polydimethylsiloxane; tensile; thin film metal strain gauges; Analytical models; Bones; Capacitive sensors; Compressive stress; In vitro; In vivo; Monitoring; Substrates; Tensile stress; Transistors;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Bioinformatics and Bioengineering, 2004. BIBE 2004. Proceedings. Fourth IEEE Symposium on
  • Print_ISBN
    0-7695-2173-8
  • Type

    conf

  • DOI
    10.1109/BIBE.2004.1317322
  • Filename
    1317322